MINI COM MODULAR FURNITURE FACEP
S600SI_MICROSD3.0 CG 16GB
POWERSOIC-20/PSOP-20/HSOP-20
类型 | 描述 |
---|---|
系列: | Proto-Advantage |
包裹: | Bulk |
零件状态: | Active |
原型板类型: | SMD to DIP |
接受包裹: | PowerSOIC, PSOP, HSOP |
职位数: | 20 |
沥青: | 0.050" (1.27mm) |
板厚: | 0.062" (1.57mm) 1/16" |
材料: | FR4 Epoxy Glass |
尺寸/尺寸: | 1.000" x 1.200" (25.40mm x 30.48mm) |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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