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| 类型 | 描述 |
|---|---|
| 系列: | SMD Grounding Metallized |
| 包裹: | Tape & Reel (TR)Cut Tape (CT) |
| 零件状态: | Active |
| 类型: | Film Over Foam |
| 形状: | Rectangle |
| 宽度: | 0.394" (10.00mm) |
| 长度: | 0.394" (10.00mm) |
| 高度: | 0.394" (10.00mm) |
| 材料: | Polyurethane Foam, Tin-Copper Polyester (SN/CU) |
| 电镀: | - |
| 电镀 - 厚度: | - |
| 附着方式: | Solder |
| 工作温度: | -40°C ~ 70°C |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
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