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MODULE XFRMR LAN T1/E1 PCB
FLX,STR,SNB
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| 类型 | 描述 |
|---|---|
| 系列: | Flexible Low Compression |
| 包裹: | Bulk |
| 零件状态: | Active |
| 类型: | Fingerstock |
| 形状: | - |
| 宽度: | 0.195" (4.95mm) |
| 长度: | 24.000" (609.60mm) |
| 高度: | 0.170" (4.32mm) |
| 材料: | Beryllium Copper |
| 电镀: | Tin |
| 电镀 - 厚度: | 299.21µin (7.60µm) |
| 附着方式: | Snap-In |
| 工作温度: | 121°C |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
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