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HEATSINK 50X50X10MM XCUT T766
HEATSINK 30X30X10MM R-TAB T766
IMAGE SENSOR 3.1MP 1/3 CIS
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| 类型 | 描述 |
|---|---|
| 系列: | - |
| 包裹: | Tray |
| 零件状态: | Active |
| 类型: | CMOS |
| 像素大小: | 2.2µm x 2.2µm |
| 有源像素阵列: | 2048H x 1536V |
| 每秒帧数: | 60 |
| 电压 - 电源: | 1.8V, 2.8V |
| 包/箱: | 63-LFBGA |
| 供应商设备包: | 63-IBGA (9.5x9.5) |
| 工作温度: | -30°C ~ 85°C |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
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