类型 | 描述 |
---|---|
系列: | CameraChip™, OmniBSI+™ |
包裹: | Tray |
零件状态: | Active |
类型: | CMOS with Processor |
像素大小: | 1.4µm x 1.4µm |
有源像素阵列: | 2592H x 1944V |
每秒帧数: | 16 |
电压 - 电源: | 2.8V |
包/箱: | BGA - Module |
供应商设备包: | Module |
工作温度: | -30°C ~ 70°C (TJ) |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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NE2D RGB FOV120 F2.8 NB 3M FT SE |
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INTEGRATED CIRCUIT |