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| 类型 | 描述 |
|---|---|
| 系列: | CameraChip™, OmniBSI+™ |
| 包裹: | Tray |
| 零件状态: | Active |
| 类型: | CMOS |
| 像素大小: | 1.75µm x 1.75µm |
| 有源像素阵列: | 400H x 400V |
| 每秒帧数: | 30 |
| 电压 - 电源: | 3.3V |
| 包/箱: | BGA - Module |
| 供应商设备包: | Module |
| 工作温度: | -20°C ~ 70°C (TJ) |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
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