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SOLDER 500G JAR,SN96.5 AG3.0
IC FLASH 256MBIT PARALLEL 64FBGA
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| 类型 | 描述 |
|---|---|
| 系列: | R520A |
| 包裹: | Jar |
| 零件状态: | Active |
| 类型: | Solder Paste |
| 作品: | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| 直径: | - |
| 熔点: | 423 ~ 424°F (217 ~ 218°C) |
| 助焊剂类型: | Water Soluble |
| 线规: | - |
| 过程: | Lead Free |
| 形式: | Jar, 17.64 oz (500g) |
| 保质期: | 4 Months |
| 保质期开始: | Date of Manufacture |
| 储存/冷藏温度: | 32°F ~ 50°F (0°C ~ 10°C) |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
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