类型 | 描述 |
---|---|
系列: | Weller® |
包裹: | Bag |
零件状态: | Active |
尖端类型: | Rework (Hot Air), SMD |
尖端形状: | Nozzle |
高度: | - |
宽度: | 0.551" (14.00mm) |
长度: | 0.394" (10.00mm) |
直径: | - |
尖端芯片尺寸: | SOIC-20 |
温度范围: | - |
用于/相关产品: | HAP2, HAP3 |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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