PULSE XFMR 7.63UH SMD
SMA-SP/SMP-SP G178 36I
类型 | 描述 |
---|---|
系列: | VERSA-PAC® |
包裹: | Bulk |
零件状态: | Active |
类型: | - |
应用: | - |
预期的芯片组: | - |
芯片组制造商: | - |
电压 - 初级: | - |
电压 - 辅助: | - |
电压 - 隔离: | - |
电感@频率: | - |
频率: | - |
工作温度: | -40°C ~ 125°C |
安装类型: | Surface Mount |
尺寸/尺寸: | 0.827" L x 1.122" W (21.00mm x 28.50mm) |
坐姿高度(最大): | 0.425" (10.80mm) |
脚印: | - |
风格: | - |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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