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| 类型 | 描述 |
|---|---|
| 系列: | VERSA-PAC® |
| 包裹: | Bulk |
| 零件状态: | Active |
| 类型: | - |
| 应用: | - |
| 预期的芯片组: | - |
| 芯片组制造商: | - |
| 电压 - 初级: | - |
| 电压 - 辅助: | - |
| 电压 - 隔离: | - |
| 电感@频率: | - |
| 频率: | - |
| 工作温度: | -40°C ~ 125°C |
| 安装类型: | Surface Mount |
| 尺寸/尺寸: | 0.709" L x 0.969" W (18.00mm x 24.60mm) |
| 坐姿高度（最大）: | 0.394" (10.00mm) |
| 脚印: | - |
| 风格: | - |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
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