类型 | 描述 |
---|---|
系列: | MXSMIO™ |
包裹: | Tray |
零件状态: | Active |
内存类型: | Non-Volatile |
内存格式: | FLASH |
技术: | FLASH - NOR |
内存大小: | 32Mb (8M x 4) |
内存接口: | SPI - Quad I/O |
时钟频率: | 133 MHz |
写周期时间 - 字,页: | 50µs, 1.2ms |
访问时间: | - |
电压 - 电源: | 2.65V ~ 3.6V |
工作温度: | -40°C ~ 85°C (TA) |
安装类型: | Surface Mount |
包/箱: | 8-WDFN Exposed Pad |
供应商设备包: | 8-WSON (6x5) |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
FM27C010V90Rochester Electronics |
IC EPROM 1MBIT PARALLEL 32PLCC |
|
70V3319S133BCIRenesas Electronics America |
IC SRAM 4.5MBIT PAR 256CABGA |
|
AS7C351232-10BINTRAlliance Memory, Inc. |
IC SRAM 16MBIT PARALLEL 90TFBGA |
|
24LC08BHT-E/STRoving Networks / Microchip Technology |
IC EEPROM 8KBIT I2C 8TSSOP |
|
AT24C01BY6-YH-TRochester Electronics |
IC EEPROM 1KBIT I2C 8MINI MAP |
|
IS42VM16160K-6BLIISSI (Integrated Silicon Solution, Inc.) |
IC DRAM 256MBIT PARALLEL 54TFBGA |
|
MT49H16M36SJ-25E:B TRMicron Technology |
IC DRAM 576MBIT PARALLEL 144FBGA |
|
W25Q32JVZPIQWinbond Electronics Corporation |
IC FLASH 32MBIT SPI/QUAD 8WSON |
|
MX25L6433FXCI-08GMacronix |
IC FLSH 64MBIT SPI/QUAD 24CSPBGA |
|
70V3389S5BC8Renesas Electronics America |
IC SRAM 1.125MBIT PAR 256CABGA |
|
S25FL116K0XMFA011Flip Electronics |
IC FLASH 16MBIT SPI/QUAD 8SOIC |
|
AT25PE20-MHN-TAdesto Technologies |
IC FLASH 2MBIT SPI 85MHZ 8UDFN |
|
W74M25JVZEIQWinbond Electronics Corporation |
IC FLASH 256MBIT SPI/QUAD 8WSON |