类型 | 描述 |
---|---|
系列: | pushPIN™ |
包裹: | Tray |
零件状态: | Active |
类型: | Top Mount |
包冷却: | Assorted (BGA, LGA, CPU, ASIC...) |
附着方式: | Push Pin |
形状: | Square, Fins |
长度: | 1.575" (40.00mm) |
宽度: | 1.575" (40.00mm) |
直径: | - |
翅片高度: | 0.984" (25.00mm) |
功耗@温升: | - |
热阻@强制气流: | 4.14°C/W @ 100 LFM |
热阻@自然: | - |
材料: | Aluminum |
材料完成: | Blue Anodized |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
ATS-21F-184-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
|
ATS-15C-64-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
|
ATS-02C-94-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
|
909-37-1-15-2-B-0Wakefield-Vette |
HEAT SINK ELLIP FIN 37X37MM CLIP |
|
HSIBQ800-AiBASE Technology |
HEAT SINK FOR IBQ800 (H052HSIBQ8 |
|
630-35ABT5Wakefield-Vette |
HEATSINK FOR 35MM BGA |
|
40482Vicor |
BOM ASSY 4623 XF PUSH PIN HTSN |
|
532602B00000Aavid |
BOARD LEVEL HEAT SINK |
|
902-21-1-18-2-B-0Wakefield-Vette |
HEAT SINK ELLIP FIN 21X21MM CLIP |
|
905-29-1-23-2-B-0Wakefield-Vette |
HEAT SINK ELLIP FIN 29X29MM CLIP |
|
ATS-13F-184-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
|
547-95ABWakefield-Vette |
HEATSINK DC/DC QUARTER BRICK |
|
ATS-04E-184-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |