English
简体中文
CABLE FLAT FLEX 25COND 0.050"
HEATSINK FOR 35MM BGA
图片仅供参考，请联系我们获取真实图片
| 类型 | 描述 |
|---|---|
| 系列: | 630 |
| 包裹: | Bulk |
| 零件状态: | Active |
| 类型: | Top Mount |
| 包冷却: | BGA |
| 附着方式: | Thermal Tape, Adhesive (Not Included) |
| 形状: | Square, Pin Fins |
| 长度: | 1.378" (35.00mm) |
| 宽度: | 1.378" (35.00mm) |
| 直径: | - |
| 翅片高度: | 0.350" (8.89mm) |
| 功耗@温升: | - |
| 热阻@强制气流: | 5.00°C/W @ 500 LFM |
| 热阻@自然: | - |
| 材料: | Aluminum |
| 材料完成: | Black Anodized |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
|
|
40482Vicor |
BOM ASSY 4623 XF PUSH PIN HTSN |
|
|
532602B00000Aavid |
BOARD LEVEL HEAT SINK |
|
|
902-21-1-18-2-B-0Wakefield-Vette |
HEAT SINK ELLIP FIN 21X21MM CLIP |
|
|
905-29-1-23-2-B-0Wakefield-Vette |
HEAT SINK ELLIP FIN 29X29MM CLIP |
|
|
ATS-13F-184-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
|
|
547-95ABWakefield-Vette |
HEATSINK DC/DC QUARTER BRICK |
|
|
ATS-04E-184-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
|
|
552703B00000Aavid |
BOARD LEVEL HEAT SINK |
|
|
HSIB908-BGA-1iBASE Technology |
AC, HEATSINK FOR IB908 ONLY , (R |
|
|
ATS-09G-184-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
|
|
ATS-03G-184-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
|
|
655-26ABT5Wakefield-Vette |
HEATSINK FOR 40MM BGA |
|
|
0372504040Woodhead - Molex |
CHIPSET COOLER CU #1 6500 RPM |