类型 | 描述 |
---|---|
系列: | - |
包裹: | Box |
零件状态: | Active |
类型: | - |
包冷却: | - |
附着方式: | - |
形状: | - |
长度: | - |
宽度: | - |
直径: | - |
翅片高度: | - |
功耗@温升: | - |
热阻@强制气流: | - |
热阻@自然: | - |
材料: | - |
材料完成: | - |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
658-45ABT5Wakefield-Vette |
HEATSINK CPU 28MM SQ BLK W/TAPE |
|
547-95AB-T725Wakefield-Vette |
HEATSINK DC/DC QUARTER BRICK |
|
ATS-06F-184-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
|
ATS-55400W-C0-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X24.5MM W/OUT TIM |
|
ATS-X51450R-C1-R0Advanced Thermal Solutions, Inc. |
MAXIFLOW 44.25X44.25X19.5MM T766 |
|
2334BGAavid |
HEAT SINK |
|
HSIB915-BGA-BiBASE Technology |
AC, HEATSINK FOR IB915 SERIES, ( |
|
431KWakefield-Vette |
HEATSINK FOR PWR SEMI |
|
ATS-12B-05-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM XCUT T766 |
|
669-33ABT3Wakefield-Vette |
HEATSINK ASSY FOR SPGA |
|
ATS-54425R-C0-R0Advanced Thermal Solutions, Inc. |
HEATSINK 42.5X42.5X19.5MM NO TIM |
|
ATS-09E-64-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
|
532802B02500GAavid |
BOARD LEVEL HEAT SINK |