类型 | 描述 |
---|---|
系列: | - |
包裹: | Bulk |
零件状态: | Active |
类型: | Top Mount |
包冷却: | TO-5 |
附着方式: | Bolt On |
形状: | Cylindrical |
长度: | - |
宽度: | - |
直径: | 0.318" (8.07mm) ID, 0.602" (15.29mm) OD |
翅片高度: | 0.250" (6.35mm) |
功耗@温升: | 1.6W @ 80°C |
热阻@强制气流: | 30.00°C/W @ 200 LFM |
热阻@自然: | - |
材料: | Aluminum |
材料完成: | Red Anodized |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
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642-35ABT5Wakefield-Vette |
HEATSINK FOR 35MM BGA |
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ATS-13F-94-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
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652503B02500,MODG (065365)Aavid |
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ATS-14D-94-C2-R0Advanced Thermal Solutions, Inc. |
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ATS-08H-156-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
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ATS-14A-64-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
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642-45ABT3Wakefield-Vette |
HEATSINK FOR 35MM BGA |
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ATS-02H-156-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
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ATS-EXL119-1220-R0Advanced Thermal Solutions, Inc. |
PCIE EXTRUSION PROFILE, AL6063 |
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625-60ABT4EWakefield-Vette |
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ATS-06F-156-C2-R0Advanced Thermal Solutions, Inc. |
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7121DGAavid |
BOARD LEVEL HEAT SINK |
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