类型 | 描述 |
---|---|
系列: | pushPIN™ |
包裹: | Tray |
零件状态: | Active |
类型: | Top Mount |
包冷却: | Assorted (BGA, LGA, CPU, ASIC...) |
附着方式: | Push Pin |
形状: | Square, Fins |
长度: | 1.575" (40.00mm) |
宽度: | 1.575" (40.00mm) |
直径: | - |
翅片高度: | 0.984" (25.00mm) |
功耗@温升: | - |
热阻@强制气流: | 4.14°C/W @ 100 LFM |
热阻@自然: | - |
材料: | Aluminum |
材料完成: | Blue Anodized |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
![]() |
ATS-55230D-C0-R0Advanced Thermal Solutions, Inc. |
HEATSINK 23X23X9.5MM W/OUT TIM |
![]() |
626-25ABPEWakefield-Vette |
HEATSINK FOR TO218/TO220 |
![]() |
ATS-11A-94-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM R-TAB T766 |
![]() |
TX31847RCTS Corporation |
HEAT SINK ELECT ISO TO-18 |
![]() |
519803B00000GAavid |
BOARD LEVEL HEAT SINK |
![]() |
ATS-55325D-C0-R0Advanced Thermal Solutions, Inc. |
HEATSINK 32.5X32.5X9.5MM NO TIM |
![]() |
698-80ABWakefield-Vette |
HEATSINK EXTRUSION 45MM |
![]() |
ATS-54325K-C0-R0Advanced Thermal Solutions, Inc. |
HEATSINK 32.5X32.5X14.5MM NO TIM |
![]() |
ATS-05C-64-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
![]() |
HSIB906-BGAiBASE Technology |
AC, HEATSINK FOR IB906F-1G, (ROH |
![]() |
ATS-X51250R-C1-R0Advanced Thermal Solutions, Inc. |
MAXIFLOW 24.25X24.25X19.5MM T766 |
![]() |
401VWakefield-Vette |
HEATSINK POWER TO-3 |
![]() |
132-15.5BWakefield-Vette |
HEATSINK EXTRUDED |