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| 类型 | 描述 |
|---|---|
| 系列: | pushPIN™ |
| 包裹: | Tray |
| 零件状态: | Active |
| 类型: | Top Mount |
| 包冷却: | Assorted (BGA, LGA, CPU, ASIC...) |
| 附着方式: | Push Pin |
| 形状: | Square, Fins |
| 长度: | 1.575" (40.00mm) |
| 宽度: | 1.575" (40.00mm) |
| 直径: | - |
| 翅片高度: | 0.984" (25.00mm) |
| 功耗@温升: | - |
| 热阻@强制气流: | 9.39°C/W @ 100 LFM |
| 热阻@自然: | - |
| 材料: | Aluminum |
| 材料完成: | Blue Anodized |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间：周一至周五，9:00-18:30(GMT+8)
电话: 00852-52612101
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581101B02500GAavid |
HEAT SINK |
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BOARD LEVEL HEAT SINK |
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HEATSINK FOR 35MM BGA |
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ATS-13F-94-C2-R0Advanced Thermal Solutions, Inc. |
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ATS-08H-156-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
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ATS-14A-64-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
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642-45ABT3Wakefield-Vette |
HEATSINK FOR 35MM BGA |
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ATS-02H-156-C2-R0Advanced Thermal Solutions, Inc. |
HEATSINK 40X40X25MM L-TAB T766 |
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ATS-EXL119-1220-R0Advanced Thermal Solutions, Inc. |
PCIE EXTRUSION PROFILE, AL6063 |
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625-60ABT4EWakefield-Vette |
HEATSINK FOR 25MM BGA |
