类型 | 描述 |
---|---|
系列: | * |
包裹: | Tray |
零件状态: | Active |
类型: | - |
输入类型: | - |
输出类型: | - |
供电: | - |
工作温度: | - |
安装类型: | - |
包/箱: | - |
供应商设备包: | - |
UNIT2, 22/F., RICHMOND COMM. 香港九龙旺角亚皆老街109号大厦
办公时间:周一至周五,9:00-18:30(GMT+8)
电话: 00852-52612101
ZSSC3135BE1DRenesas Electronics America |
DICE (WAFER SAWN) - WAFFLE PACK |
|
ZSC31050FECRenesas Electronics America |
DICE (WAFER SAWN) - FRAME |
|
HPA01046RGWRTexas Instruments |
SENSOR SIGNALING CONDITIONING FO |
|
MAX14838GWC+TMaxim Integrated |
24V 100MA PIN-CONFIGURABLE INDUS |
|
MLX90320LFR-BBA-000-REMelexis |
IC SENSOR INTERFACE AUTO 14SSOP |
|
ZSSC3154BA1CRenesas Electronics America |
DICE (WAFER SAWN) - FRAME |
|
ZSC31050FADRenesas Electronics America |
DICE (WAFER SAWN) - WAFFLE PACK |
|
ZSC31050FACRenesas Electronics America |
DICE (WAFER SAWN) - FRAME |
|
PGA308TDD2Texas Instruments |
IC PROG SENSOR SGNL COND DIE |
|
MAX32664GWED+TMaxim Integrated |
SENSOR HUB W/ SPO2, HR & BP ALGO |
|
ZSSC3016CC6BRenesas Electronics America |
WAFER (UNSAWN) - BOX |
|
ZSSC3135BE1CRenesas Electronics America |
DICE (WAFER SAWN) - FRAME |
|
DAC100BIDDQ7Rochester Electronics |
10-BIT CCD SIGNAL PROCESSOR |